Chengyi Electronics (Jiaxing) Co., Ltd

In 5G era, PCB used in base stations will tend to be more multi-layer and highly integrated design. In addition to structural changes, 5G will have larger data volume, higher transmission frequency and higher working frequency band, which will require the base stations use PCB that have better transmission performance and heat dissipation performance. Therefore, the electronic substrate used for 5G PCB needs to be higher frequency, higher transmission speed and better heat resistance.   5G Application Scenarios Base stations in 5G era have been adjusted to a certain extent compared with 4G, BBU is split into CU (certain unit) and DU (distributed unit) and it is beneficial to realize multi-connection, collaboration of high and low frequency, and simplify switching process. The CU of several base stations can be merged together or separated. Antenna and RRU can become an AAU to complete signal transceiving, scaling, filtering, photoelectric conversion and other work.   The Price...

5G Construction Will Drive the Output of High-end PCB After the issuance of 5G official license, the market space of base station laying will be accelerated, which will drive the output of high-end PCB such as high frequency, high speed and multi-layer upstream. It is predicted that the total investment space of PCB brought by domestic 5G macro station construction will be about 30 billion yuan, and the incremental space of PCB industry for communication and credit is expected to reach its peak between 2022 and 2023.The 5G construction greatly expands the downstream application scene, and the terminal PCB has a good prospect.   5G Pulls PCB Industry from Base Station to Terminal Application Base stations and intelligent terminals and other industries have provided growth impetus for the PCB industry. 5G penetrates into terminal equipment from base station construction, and the communication PCB used in base station benefits first, with volume and price rising si...

PCB value distribution of the five automotive systems. Automobile electronization resonates with the trend of new energy,  automotive PCB market  expansion. Five automotive electronic systems promote PCB product upgrade. From the perspective of automotive PCB application scale division, among the five systems, market size order ranks as below: power engine control system > car body control safety system > vehicle communication system > vehicle interior installation system > lighting system. The functional upgrade of the five systems in the future will promote the application level of PCB products to a higher level: 1) Power engine control, high voltage, high current, thick copper processing technology; 2) Body control safety system: high frequency signal transmission, using high frequency materials; 3) Vehicle-mounted communication and interior decoration, switching from multi-layer boards to high-density interconnection boards; 4) Lighting: LED lights are used, an...