Chengyi Electronics (Jiaxing) Co., Ltd

  Application area: Automotive Product feature: Immersion tin board Layer: 4 Surface treatment: Immersion Tin Material: FR4 Line width/Line space: 0.254/0.20mm Thickness: 1.6mm Min hole φ: 0.45mm What is Immersion Tin Plating? Immersion tin is a coating of tin deposited on the copper layer of a PCB using an  electroless chemical process . The tin layer protects the board from oxidation, extending its shelf life. It is usually white after electroplating, so it is called white tin. What is Immersion Tin PCB? PCB tinning is the process of covering copper traces with a layer of tin, which will prevent any possible degradation, oxidation or corrosion of them. Tin plating also helps mask copper traces when etching the board itself. Immersion tin pcb surface finish describes a very thin layer of tin applied to the copper layer of the PCB. This method is a lead-free PCB alternative that produces a consistently flat surface that solders well and is cost-effective. The tin layer is us...

  Have you ever considered the essentialness of a  printed circuit board assembly ? PCB assembly is done by simply arranging electrical units on a circuit board. To give a better understanding, PCB boards are in every single electronic device. No matter if it is a phone, smartwatch, or computer, PCBs are inside every device that directs signals electronically. When it comes to the quick turn PCB assembly process, soldering is the first imperative step. One wrong turn in the soldering manufacture can result in a massive error. Since soldering is key to a successful assembly, it is essential to turn to a quick turn PCB assembly manufacturer who knows what they are doing.     Behind PCB assembly When it comes to custom PCB assembly, different techniques are utilized to attach units to the boards. Generally, some PCBs can be produced in large quantities. When this occurs, a machine assists in picking and putting down units of the assembly pr...

  Trick Takeaways ► When energy gets paired between two or more lines that are placed adjacent to each other, it produces crosstalk. ► Stub alternated and parallel serpentine microstrip lines in  PCBs alter  capacitive combining and adjust it to inductive combining, which minimizes crosstalk. ► An error correction technique can be a single error correction or multiple error corrections, relying on aspects such as intricacy, effectiveness, hold-up, and power usage.     In the electronics market, lowering the size of a digital circuit or tool with the very same or better functional attributes compared to its existing model can save money. As the size is decreased with sophisticated attributes, it causes a high-density inner system. In these devices, subcircuits, wires, and parts are near achieved high packing thickness. However, miniaturization in electronics deals with an issue of unwanted coupling of signals in nearby lines, otherwise called crosstalk. In h...

  Application area:Automotive Product feature: Red Ink Layer: 2 Surface treatment: ENIG Material: FR4 Line width/Line space: 0.254/0.346mm Thickness: 1.0mm Min hole φ: 0.45mm Product feature: The  ENIG automobile reversing radar  features a unique product characteristic:  Red Ink.  This distinctive attribute enhances visibility and aesthetics, allowing for easy identification and integration within the vehicle's exterior. Beyond its visual appeal, the red ink coating serves as a protective layer, ensuring durability and resistance to environmental factors such as moisture and temperature fluctuations. With its combination of functional and aesthetic benefits, the  ENIG automobile reversing radar with Red Ink  stands out as a reliable and visually appealing solution for vehicle safety systems. Surface treatment: The   surface treatment for the ENIG (Electroless Nickel Immersion Gold) automobile reversing radar  is ENIG, a highly reliable ...

  In the realm of printed circuit boards (PCBs),  surface finishes  play a pivotal role in determining the overall performance, reliability, and longevity of electronic devices. Among the myriad options available, HASL (Hot Air Solder Leveling), OSP (Organic Solderability Preservative), and ENIG (Electroless Nickel Immersion Gold) stand out as the most commonly employed surface finishes. Each presents a unique set of characteristics and benefits, catering to diverse application requirements. In this comprehensive guide, we delve into the intricacies of each surface finish, offering insights to aid in informed decision-making. Understanding HASL (Hot Air Solder Leveling) HASL  characterized by its simplicity and cost-effectiveness, remains a popular choice for PCB surface finishing. The process involves immersing the PCB into a bath of molten solder, followed by a blast of hot air to remove excess solder, leaving behind a uniform coating on exposed...

  Choosing the surface finish is an essential step in the design of your printed circuit boards. The PCB surface finish helps protect copper circuitry from corrosion. It also provides a solderable surface for your components. There are a number of factors to consider, including: The components you use Your expected production volume Your requirements for durability Environmental impact, and Cost Below are 5 types of PCB surface finishes, along with their benefits and drawbacks. Finish Type #1 – Hot Air Solder Leveling (HASL) “Hot Air Solder Leveling” is the least expensive type of PCB surface finish. It is widely available and very economical. The board is dipped in molten solder and then leveled off with a hot air knife. If you’re using through-hole or larger SMT components,  HASL  can work well. However, if your board will have SMT components smaller than 0805 or SOIC, it is not ideal. The surface is not completely level, so this can cause issues with small components. ...

  In the realm of printed circuit boards (PCBs), the immersion tin process holds a crucial position. This article aims to elucidate the intricacies of immersion tin plating on PCBs, providing a comprehensive overview of its process, significance, and applications. What is Immersion Tin? Immersion tin , also known as organic solderability preservative (OSP), is a surface finish applied to PCBs to protect the copper traces during storage and assembly. It ensures the preservation of copper and facilitates solderability, playing a pivotal role in the PCB manufacturing process.   The Process of Immersion Tin on PCBs Surface Preparation Before immersing PCBs in the tin solution, thorough surface preparation is imperative. This involves meticulous cleaning to remove any contaminants or oxidation from the copper surface. The cleanliness of the copper directly impacts the quality and efficacy of the immersion tin process. Activation Activation is a crucial step that primes the copper s...